Your preferred partner for establishing wafer manufacturing and post-processing technologies
Physical Vapor
Transport System
Accelerate your SiC Technology development with the next-generation PVT System.
Xforge PVT
High
Temperature
Cutting-edge high precision furnace for different high temperature
heating applications.
Xforge HT
Excellence
at Every Level
at Every Level
Broad temperature range • Engineered for peak performance • User-friendly interface for efficient use • Customizable coil configurations • Process pressure monitoring throughout • Premium quality components • Safe and simple operation
Broad temperature range • Engineered for peak performance • User-friendly interface for efficient use • Customizable coil configurations • Process pressure monitoring throughout • Premium quality components • Safe and simple operation
Broad temperature range • Engineered for peak performance • User-friendly interface for efficient use • Customizable coil configurations • Process pressure monitoring throughout • Premium quality components • Safe and simple operation
Pioneering Swedish
Engineering
With nearly a century of combined experience in semiconductor material research, SiC growth and related technologies, TekSic aims to be your preferred partner for establishing wafer manufacturing and post-processing technologies.
EXPLORE TekSic
News
TekSiC Navigates the Evolving Landscape of Silicon Carbide Manufacturing – Appoints Joachim Tollstoy as New CEO
9 December 2024
Linköping, Sweden – November 5, 2024 – TekSiC AB, an innovation leader in silicon carbide wafer manufacturing technology, is excited to announce the appointment of Joachim Tollstoy as its new Chief Executive Officer (CEO), effective October 7, 2024. With over 15 years of leadership experience, Joachim brings a visionary perspective and a keen understanding of market dynamics that will be essential as TekSiC navigates the evolving landscape of silicon carbide manufacturing.